ASUS PRIME X299 EDITION 30 INTEL X299 SOCKET 2066 INTEL X-SERIES ATX 8XDDR4-4266 PCI-E3.0 M.2 SATA3 RAID USB 3.2
Intel ATX motherboard LGA 2066 for Intel Core X-series processors with AI Overclocking, 16 IR3555 power stages, DDR4 4266 MHz, Wi-Fi 6, 5 Gbps Ethernet, Type-C Thunderbolt 3 ports, Triple M.2, USB 3.2 front panel connector and Aura Sync RGB lighting
*Intel LGA 2066 socket: Ready for the latest Intel® Core™ X-series processors
*AI Overclocking: Quickly optimizes your CPU performance based on the CPU and cooler, achieving results that are extremely close to manual tuning by experts
*Robust power design: 16 IR3555 power stages, ProCool II connectors, alloy chokes and 10K Japanese-made capacitors for stable power delivery
*Comprehensive thermal design: Skived-fin heatsink, active heatsink, M.2 heatsinks, 2Oz-PCB design and backplates.
*Next-gen connectivity: Two Type-C™ Thunderbolt 3 with DisplayPort 1.4, three M.2 and front USB 3.1 Gen 2 connector
*High-performance networking: Onboard Wi-Fi 6 (802.11ax) with MU-MIMO support, Aquantia® 5 Gbps Ethernet and Intel Gigabit Ethernet
The new, special Prime X299 Edition 30 celebrates three decades of ASUS motherboard development. This high-end desktop combines cutting-edge performance with our signature features, including a powerful VRM tailored for overclocking, intuitive cooling control, next-gen connectivity, and extensive customization. It also has a brand-new Smart Control Console with an external OLED.
Get the most out of all your cores
Intel®'s high-end desktop platform raises the stakes with updated Intel Core™ X-Series Processors that boast cores, cache, and bandwidth. The Prime X299 Edition 30 is ready for the additional processing power that plows through CPU-intensive tasks, and the extra bandwidth allows you to add more GPUs and NVMe SSDs to accelerate a wide range of work.
Robust Power Design
The LGA 2066 socket is compatible with the latest Intel Core X-Series Processors with up to 18 cores, over 44 PCI Express® lanes, and 165-watt thermal design power (TDP). Those specs require serious power, especially if you're overclocking, so the Prime X299 Edition 30 is equipped with a premium power solution that includes 16 power stages that line up neatly along the top edge of the PCB. The power stages are cooled well enough to sustain a staggering up to 544 W output, which is more than enough to overclock 18-core CPUs into truly extreme territory.
Cool to the core
Effective cooling is extremely important, even at stock speeds. That is why the Prime X299 Edition 30 allows consolidated cooling control of the entire system, even for the most hardcore rigs. It comes equipped with onboard heatsinks, an array of fan headers, the Fan Extension Card II, options for water pump and AIO headers.
Actively Cooled Heatsink
Since mass and airflow are critically important, our VRM heatsink is manufactured with skived, high aspect ratio thin fins. The hidden 40 mm fan turns on after 60°C. This combination offers optimal cooling for CPU-intensive tasks.
Tune it your way
Comprehensive controls form the foundation of the ASUS Prime series. The Prime X299 Edition 30 packs flexible tools to tune every aspect of your system to deliver the performance that you desire.
SpecificationsAudioRealtek® S1220A 8-Channel High Definition Audio CODEC - Power pre-regulator reduces power input noise to ensure consistent performance - Impedance sense for front and rear headphone outputs - Internal audio Amplifier to enhance the highest quality sound for headphone and speakers - Supports : Jack-detection, Multi-streaming, Front Panel Jack-retasking Audio Feature : - DTS X®:Ultra - Optical S/PDIF out port(s) at back panel - Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals - Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity - Unique de-pop circuit: Reduces start-up popping noise to audio outputsChipsetIntel® X299Form FactorATXI/O Connectors Integrated CPU Graphics LANAquantia AQC111C 5G LAN Intel® I219V, 1 x Gigabit LAN ASUS Turbo LAN Utility ASUS LAN GuardMemory/Type/Bus/Max.8XDIMM/DDR4/4266 MHz/256GBMisc. Other I/O Connectors PCI Slots Processor SupportIntel® Socket 2066 Core™ X-Series ProcessorsRaid0, 1, 5, 10RAM Type/Bus/Max. SocketIntel LGA2066Storage Interfacentel® X299 Chipset : 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (SATA & PCIE 3.0 x 4 mode)*3 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*4 8 x SATA 6Gb/s port(s)*5 Support Raid 0, 1, 5, 10 Intel® Rapid Storage Technology supports (Intel® Core™ i9 10000 X-Series CPU) : 2 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*4 Support Raid 0, 1, 5, 10 Intel® Virtual RAID on CPU(VROC) (Intel® Core™ i9 9000/7000 and i7 9000 X-Series CPU) : 1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*4 Support Raid 0, 1, 5, 10 Intel® Virtual RAID on CPU(VROC) Intel® Optane™ Memory Ready *6USB PortsIntel® Thunderbolt™ 3 Controller : 2 x USB 3.2 Gen 2 port(s) (USB Type-CTM) ASMedia® USB 3.2 Gen 2 controller : *1 1 x USB 3.2 Gen 2 front panel connector port(s) GL852G USB Hub : 4 x USB 2.0 port(s) Intel® X299 Chipset : 5 x USB 3.2 Gen 1 port(s) (1 at back panel, , 4 at mid-board) Intel® X299 Chipset : 2 x USB 2.0 port(s) (2 at back panel, ) ASMedia® USB 3.2 Gen 1 Hub : 3 x USB 3.2 Gen 1 port(s) (3 at back panel, )Video Output Warranty Weight